| Features | High Temperature Resistance |
|---|---|
| Hermetic Test | 4.0MPa With N2,No Leak |
| Sealing Method | Hermetic Sealing |
| Salt Spray Resistance | 48h |
| Resistance | 1000MΩ@500VDC |
| Contact Plating | Nickel |
|---|---|
| Operation Voltage | 24V |
| Insulation Resistance | 1000MΩ |
| Working Temperature | -40°C ~ + 150°C |
| Pin Material | 45 Steel |
| Plating | Q355B |
|---|---|
| Insulationresistance | ≥1000 MΩ |
| Glass Material | ELAN #48 |
| Sealingtype | Hermetic |
| Operation Voltage | 420VAC ~ 935VAC |
| Thickness | 2~4 μm. |
|---|---|
| Burst Test | 4MPa With N2 Press |
| Application | Aerospace, Military, Industrial Equipment |
| Temperature Rating | -40°C To 150°C |
| Pin Material | SUH446 WITH COPPER CORED, RATIO 2:1 |
| Features | High Temperature Resistance |
|---|---|
| Pin Material | SUH446 WITH COPPER CORED, RATIO 2:1 |
| Leak Test | LEAK RATE≤1X10^-8 Mbar.l/s |
| Insulationresistance | ≥1000 MΩ |
| High Sealing Performance | 2.5MPa Does Not Leak |
| Sealingtype | Hermetic |
|---|---|
| Insulation Resistance | 500MΩ Min |
| OperatiomCurrent | 30AMAX |
| Insulationmaterial | CERAMIC |
| High Sealing Performance | 2.5MPa Does Not Leak |
| 評価される流れ | 30A |
|---|---|
| 定位電圧 | 600V |
| 温度範囲 | -70°Cから300°C |
| 材料 | 45鋼鉄 |
| 表面処理 | 無電解ニッケルめっき |
| マウントタイプ | 端末固定ボルト |
|---|---|
| 温度範囲 | -70°Cから300°C |
| 評価される流れ | 30A |
| 材料 | 45鋼鉄 |
| 定位電圧 | 600V |
| 温度範囲 | -70°Cから300°C |
|---|---|
| マウントタイプ | 端末固定ボルト |
| 評価される流れ | 30A |
| 表面処理 | 無電解ニッケルめっき |
| 定位電圧 | 600V |
| Current Rating | 20A |
|---|---|
| Salt Spray Resistance | 48h |
| Contact Resistance | 2mΩ |
| Burst Test | 5.0MPa |
| Sealing Method | Hermetic Seal |
