| Surface Treatment | Electroless Nickel |
|---|---|
| Mechanicalstrength | High Tensile And Compressive Strength |
| Sealing Method | Glass-to-Metal Seal |
| Connector Type | Single Pin |
| Leakrate | < 1 X 10^-9 Atm-cc/sec |
| High Sealing Performance | 4MPa Does Not Leak |
|---|---|
| Sealing Method | Glass To Metal Seal |
| Electricalinsulation | High Dielectric Strength |
| Leak Test | 4MPa N2 Pressure No Leak |
| Thermalexpansioncoefficient | Matched Between Glass And Metal |
| Productname | Glass To Metal Seals |
|---|---|
| Surface Treatment | Electroless Nickel Plating |
| Operating Temperature | -55°C To +200°C |
| Body | 304 STAINLESS STEEL |
| Corrosionresistance | Excellent |
| High Sealing Performance | 3.5MPa Does Not Leak |
|---|---|
| Insulation Resistance | 10^9 Ohms |
| Pin | 4J28 ALLOY |
| Color | Silvery |
| Insulator Resistance | 100MΩ@500VDC |
| Thickness | 2~4 μm. |
|---|---|
| Burst Test | 4MPa With N2 Press |
| Application | Aerospace, Military, Industrial Equipment |
| Temperature Rating | -40°C To 150°C |
| Pin Material | SUH446 WITH COPPER CORED, RATIO 2:1 |
| Pin Materials | 4J50 ALLOY |
|---|---|
| Leakrate | < 1x10^-9 Atm-cc/sec |
| Application | Electrical Feedthroughs, Vacuum Tubes, Sensors |
| Connector Shell Material | 316L STAINLESS STEEL |
| Insulator Resistance | 2000MΩ@1000VDC |
| 温度範囲 | -70°Cから300°C |
|---|---|
| マウントタイプ | 端末固定ボルト |
| 定位電圧 | 600V |
| 材料 | 45鋼鉄 |
| 表面処理 | 無電解ニッケルめっき |
| Productname | Hermetically Sealed Terminal |
|---|---|
| Burst Test | 2.5MPa |
| Sealingtype | Hermetic |
| Operating Temperature | Up To 150°C |
| Currentrating | 30A |
| Sealingtype | Hermetic |
|---|---|
| Insulation Resistance | 500MΩ Min |
| OperatiomCurrent | 30AMAX |
| Insulationmaterial | CERAMIC |
| High Sealing Performance | 2.5MPa Does Not Leak |
| 定位電流 | 30A |
|---|---|
| 定位電圧 | 600V |
| 表面処理 | 無電解ニッケルめっき |
| 温度範囲 | -70°Cから300°C |
| マウントタイプ | 端末固定ボルト |
